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Company Name:
Approximate Salary:
Not Specified
Huntsville, Alabama
United States
Position type:
Full Time
Experience level:
Entry Level
Education level:
Bachelor's Degree

Electro-Mechanical Engineer - Special Projects

The successful candidate will join a highly motived, very diverse team of electrical and mechanical engineers designing, prototyping, and fabricating cutting edge data recording and radio frequency electronics.  Candidate will act as the bridge between the mechanical and electronics worlds on the team, performing design and analysis activities on non-ruggedized and ruggedized packaging for said cutting-edge electronics.  This will include heavy interaction with the electrical design team, as often the design of the electronics must change in order to be able to be ruggedized and vice-versa.  Duties will include creation and modification of 3D solid models (in AutoCAD Inventor), preparation of 2D drawings for fabrication, and working with local shops to turn those 2D drawings into finished parts.  Position will also include doing hands-on prototyping, light mechanical modifications, and assembly / disassembly of highly complicated electro-mechanical assemblies.  Duties will also include supporting Configuration Management, Quality, and Design Process Improvement initiatives.

B.S. Degree in Mechanical Engineering

Two (2) years’ experience in ruggedized, high density electronics circuit design and packaging desired.

U.S. Citizenship.  Must be able to obtain a Security Clearance.  Successful in development of ruggedized electronics and packaging for vehicle application.  Proficiency with 3D CAD software (prefer Auto CAD Inventor).  Solid understanding of core mechanical concepts such as mechanics, heat transfer, physics, and strengths of materials.  Familiar with sheet metal, CNC, and machining techniques applicable to low rate production.  Excellent written and verbal communications skills.  Excellent organizational skills and attention to detail.

Desired Qualifications:  Familiarity with MIL-STD-810 and MIL-STD-461/464 high desired.  Experience with electronics printed circuit board layout software (prefer Mentor Graphics).  Experience with thermal management packaging of high density electronics highly desired.  Experience with ANSYS thermal analysis and modeling software also highly desired.


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